Qualcomm Snapdragon X60 is of great importance in accessing high-frequency bands.
Snapdragon X60, the third generation 5G Modem-RF System, was announced by Qualcomm. The chip’s prominent features are the mmWave-sub6 cluster, which means that the maximum data volume is 5.5 Gbps.
A combination of 5W super-speed high-frequency bands, mmWave. On the other hand, a drop of water can even be affected by a window or paper. Sub6, which is low-frequency bands, is not affected by buildings but not very fast. When we think that smartphones aren’t as fast as a cell tower, the tower sends you a quick mmWave signal, but the phone can’t send it back and send a sub6 signal.
The Snapdragon X60 adds sub6 carrier aggregation, doubling the sub6 speeds we see on the Snapdragon X55. In addition, 5 nm production started in the new system. In X55, 7 nm was used. It should be noted that the QTM535 mmWave antenna module is smaller. This shrinkage is also important for 5G evolution. Thanks to the smaller antenna, it will be adapted to thin and stylish form factors.
Snapdragon X60 will contribute to the development of 5G. It is stated that with the use of Dynamic Spectrum Sharing that allows the use of both 4G LTE and 5G, it will be possible for the world to switch to 5G over time.